There are three core optical interconnects for Artificial intelligence (AI) and machine learning (ML), respectively VCSEL, EML, and CPOs.
1. VCSEL: Vertical-Cavity Surface-Emitting Lasers, it is normally used for short link connection, it are a workhorse for optical AI interconnect technology across the industry. It features low power and low cost, it is ideal for data communications and sensing applications.
2. EML: Electro-absorption Modulated Lasers, are ideal for AI systems that scale to greater distances and hundreds of thousands, or even millions of units. This technology provides better performance at very high bandwidth and typically are first to reach volume deployments at next-generation data rates.
3. CPO: Co-Packaged Optics, is an advanced heterogeneous integration of high-speed silicon photonics onto application-specific integrated circuits for addressing next-generation bandwidth and power challenges.
